I need to choose a material for an application that requires

I need to choose a material for an application that requires it to be an excellent theorem and electric. As such a material that is: ceramic thermoplastic elastomer_____Thermoset materials have what type of bonding? A mixture of secondary and covalent bonding A mixture of ionic and covalent bonding A mixture of metallic and secondary bonding.____Adding aluminum to is considered what type of defect An interstitial or substitutional defect. Vacancy defect An edge dislocation. How does the grain size impact the strength of a material: Larger grains are stronger because they have fever grain boundaries, Larger they have more vacancies that Larger grains have lower strength because they grain boundaries. Larger grains have lower strength because they have more grain boundaries. In general, HCP structure are more difficult manufacture because They have high electronegatitvity that impacts their bond strength they have limited number of independent slip system which reduce They have extremely high modulus values due to their high bonding energy.

Solution

1. for thermal conductive material to be choose is Thermoplastics

2. Thermoplatics have secondary and covalent bonding

3. Interstitial or substitution defect

4. Larger grains have lower strength because they have fewer grain boundaries.

5. They have extremely high modulus due to high bonding energy.