The electronic packaging trend in the memory chip industry h

The electronic packaging trend in the memory chip industry has seen the evolution from using a TSOP package to a low cost solder bumped CSP with a flexible interposer. What advantages does the CSP have over the TSOP.

Solution

Chip Scale Packages (CSP’s) are in the recent boom when we talk of packaging trends.There are many reasons why CSPs have been so well accepted within the industry.

The main biggest advantages of CSPs is the size reduction of the package with repect to more traditional peripherally leaded packages.This is due to use of Ball Grid Array (BGA) pattern in design.By using BGA pattern you can increase no of interconnects and at the save time can save PCB routing space.TSOP does not have this option.

CSPs have self alignment characteristics during PCB assembly flow which are absent in TSOP arrangement.

CSPs does not have bend leads which causes coplanarity issues.Hence it facilitates PCB assembly and lowers manufacturing cost.

Also,instead of being new technology,CSPs does not require any  Surface Mount Technology (SMT) infrastructure such as assembly and manufacturing processes and equipment.CSPs uses exixting SMTs and in most cases does not require capital investment.