Discuss the various 1C packages including throughhole device

Discuss the various 1C packages including through-hole devices and surface mount devices. What are the advantages of surface mount devices compared with through-hole type of 1C packages?

Solution

Major Types of Mounting in Semiconductors

Through Hole Mounting: This mounting technique involves different components which have lead wires that are led to the board through holes, hence the name. In this method, leads
rely on holes in a multilayer PCB. The leads are then finally soldered to offer permanent mounting. The technology finds usage in

DIP aka Dual Inline Packaging

Pin Grid Array Package

Surface Mounting: This is a relatively new mounting method worked out seeing a
tremendous increase in the number of pins in Integrated Circuits. As demand for smaller weight and size of packaged weight increased, there was felt a need for a new, improved technology that came to be known as surface mount technology (SMT). In this leads are soldered on PCB surface directly rather than using hole mounting. The technology is used in

Flatpack Packages

Chip Carrier Packages

Advantages: THM provides stronger mechanical bonds than SMT, makingthrough-hole ideal for components that might undergo mechanical stress, such as connectors or transformers. Good for test and prototyping.

Disadvantages: On the bare PCB side, THM requires the drilling holes, which is expensive and time consuming.