A nickel plating process has trouble with consistency of the

A nickel plating process has trouble with consistency of the plating thickness. We want to use design of experiment to improve the process. Our target plating thickness is 116 micrometers. The process variables that we can test are t (Time) and T (solution temperature). We want to find t and T that minimize the variance in thickness. The results of a two-level, two-factor set of experiments are: Develop models to predict BOTH (i.e. two models) the thickness, P, and the variation (S_P). Use these models to determine the important factors and then use the models to find the values of t and T that minimized S_P when P = 110 micrometers. Show the plots of the coefficients for both models. Describe how you chose the settings to minimize S_P while also achieving desired P.

Solution

you have to choose the right electrodes and electrolyte by figuring out the chemical reaction or reactions you want to happen when the electric current is switched on. The metal atoms that plate your object come from out of the electrolyte, so if you want to copper plate something you need an electrolyte made from a solution of a copper salt, while for gold plating you need a gold-based electrolyte—and so on.

Next, you have to ensure the electrode you want to plate is completely clean. Otherwise, when metal atoms from the electrolyte are deposited onto it, they won\'t form a good bond and they may simply rub off again. Generally, cleaning is done by dipping the electrode into a strong acid or alkaline solution or by (briefly) connecting the electroplating circuit in reverse. If the electrode is really clean, atoms from the plating metal bond to it effectively by joining very strongly onto the outside edges of its crystalline structure.

I did not got the full answer so i did not explained you fully