A generic surface micromachining process is diagramed below

A generic surface micromachining process is diagramed below, using two layers of structural and two layers of sacrificial materials. In this case, the substrate is glass, structural layer #1 is polycrystalline silicon, and structural layer #2 is gold. Identify a set of possible candidate materials for sacrificial layer #1 and #2 out of the list of the following materials: LPCVD silicon nitride, LPCVD silicon dioxide, photo resist, and evaporated gold thin film. Briefly state the reasoning behind the decision for each item in the list.

Solution

element used in sacrificial layer 1 is evaporated gold thin film

element used in sacrificial layer 2 is LPCVD silicon nitride

because all the above material has higher resistivity and thin layer

so electron caan be transmitted