In computer chip manufacture the enduse product is an integr

In computer chip manufacture, the end-use product is an integrated circuit called a die. A number of die are processed from a single silicon wafer. Not all die manufactured from a wafer are usable. The yield (the proportion of good die per wafer) is extremely important to computer manufacturers. A certain computer chip manufacturer uses two processes to produce integrated circuits. In evaluating the performance of the processes, 100 wafers are sampled from each process. Figure 2.18 shows side-by-side boxplots of the yields from these 100 wafers from each process. Use appropriate summary measures to describe the distribution of yields for each process (approximate these from the graph). What do you conclude about the processes from this graph?

Solution

Two box plots are compared on following aspects

The average of process 1 is higher than the average of process 2.

Process 2 values have less spread than the spread of process 1

Process 1 is more skewed where as process 2 is more or less symmetric.

For the process 2 there are more outliers where as process 1 do not have outliers

From the above analysis it is clear that process 1 yield is high how ever alongwith yield spread is also very high which is not desirable.