Do some search and discuss the deep trench isolation DTI pro

Do some search and discuss the deep trench isolation (DTI) process. The discussion should include the steps and IC fabrication techniques used in the process, advantages and disadvantages.

Solution

STI is created early during the semiconductor device fabrication process, before transistors are formed. The key steps of the STI process involve etching a pattern of trenches in the silicon, more dielectricmaterials (such as silicon dioxide) to fill the trenches, and removing the excess dielectric using a technique such aschemical-mechanical planarization

Certain semiconductor fabrication technologies also include deep trench isolation, a related feature often found inanalog integrated circuits.